IC-Mart Your Trusted Source for LVDS Interface Chips

(from leading manufacturers)

Leading Global Manufacturers

1. Texas Instruments (TI)

• Category 1: Standard Point-to-Point Differential Transmission (Drivers / Receivers)
  • DS90LV031A / SN65LVDS31 (Industrial quad LVDS driver, classic and universal)
  • DS90LV032A / DS90C032B (Matching quad LVDS receiver)
  • DSLVDS1047 (Modern, low-cost, high-bandwidth 3.3V quad line driver)
  • DS90LV011A / DS90LV012A (Single-channel driver/receiver in a tiny SOT-23 package)
• Category 2: Serializers/Deserializers and Display Links (SerDes / FlatLink)
  • DS90C385AMT (Classic 28-bit FlatLink display serializer transmitter)
  • SN65LVDS301 / SN65LVDS302 (Programmable 27-bit mobile display serializer/deserializer)
  • DS90UB925Q / DS90UB926Q (Automotive-grade FPD-Link III chipset; transmits HD video, audio, and control signals)
• Category 3: Protocol Bridges and Converters (Bridges)
  • SN65DSI83 / SN65DSI84 (Core MIPI DSI to single/dual-link LVDS bridge chips; widely used in embedded platforms to support legacy panels)
  • SN75LVDS83B (Universal RGB TTL to LVDS differential signal converter)
• Category 4: Signal Buffers, Repeaters, and Redrivers (Buffers / Repeaters)
  • SN65LVDS100 (High-bandwidth universal differential repeater featuring everything-to-LVDS conversion)
  • DS25BR100 / DS15BR400 (3.125 Gbps / 800 Mbps high-speed, low-jitter LVDS signal buffer and redriver)
• Category 5: Multipoint Bus LVDS (M-LVDS)
  • SN65MLVD204A / SN65MLVD206 (Half-duplex M-LVDS transceivers; a staple for multi-node chassis backplane communication)
  • SN65MLVD047 (Quad M-LVDS line driver)

2. Analog Devices (ADI / Formerly Maxim)

• Category 1: Standard Point-to-Point Differential Transmission (Drivers / Receivers)
  • MAX9110 / MAX9111 (Ultra-low-power single/dual drivers and receivers, common in handheld devices)
  • MAX9123 / MAX9121 (High-speed quad drivers/receivers with flow-through pinout)
  • ADN4666 / ADN4668 (ADI native high-reliability 3V quad LVDS drivers/receivers)
• Category 2: Serializers/Deserializers and Display Links (SerDes / GMSL)
  • MAX9217 / MAX9218 (27-bit, 35 MHz DC-balanced high-speed video SerDes chipset)
  • MAX96752 (High-end automotive GMSL2 deserializer with an integrated dual-link LVDS/OLDI output interface)
• Category 4: Signal Buffers, Repeaters, and Switches (Buffers / Switch)
  • MAX9174 (670 MHz LVDS-to-LVDS repeater buffer featuring input multiplexing switching)
• Category 5: Multipoint Bus LVDS (M-LVDS)
  • ADN4691E / ADN4693E / ADN4696E (3.3V, 200 Mbps enhanced M-LVDS transceivers with robust 15 kV ESD protection)

3. onsemi

onsemi’s portfolio (which includes legacy Fairchild assets) focuses heavily on standard logic conversion and ultra-high-speed clock tree distribution.

• Category 1: Standard Point-to-Point Differential Transmission (Drivers / Receivers)
  • FIN1001M5X (Classic single-channel 3.3V high-speed LVDS line driver in an ultra-small package)
  • FIN1002M5X (Matching single-channel receiver)
• Category 4: Signal Buffers, Repeaters, and Clock/Data Buffers
  • NB6L11M (Ultra-high-speed differential clock/data mux buffer with high-frequency fanout LVDS outputs)

4. NXP Semiconductors

NXP is highly recognized for bridging heterogeneous display interfaces, particularly for linking computing platforms to industrial screens.

• Category 3: Protocol Bridges and Converters (Bridges)
  • PTN3460I / PTN3460IBS (Industry-standard eDP (Embedded DisplayPort) to LVDS bridge chip. This IC is essential in modern x86 industrial PCs, all-in-ones, and POS designs to connect motherboard eDP outputs to legacy LVDS panels)

5. Other Specialized Manufacturers (ST, Diodes, Toshiba)

• STMicroelectronics
  • RHFLVDS32AK1 (Aerospace-grade, radiation-hardened quad LVDS receiver. Designed specifically for satellites or extreme high-radiation environments; high per-unit cost)
• Diodes Incorporated (Formerly Pericom)
  • PI3LVD412 (High-speed 1:2 or 2:1 LVDS multiplexer/demux data switch. Used to toggle signal routes between two different LVDS sources or display screens)
• Toshiba
  • TC358775XBG (A dominant Japanese MIPI DSI to LVDS video protocol bridge chip, popular in tablets and smart hardware)

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Top Mainstream China Domestic LVDS Chip Manufacturers and Key Models

1. Lontium Semiconductor

• Market Position: A leading domestic player in high-speed mixed-signal and video bridge ICs. Lontium holds a massive market share in MIPI, HDMI, eDP, and LVDS cross-conversions. Its chips are widely used in industrial panels, automotive displays, and smart hardware.
• Key Models & Functions:
  • LT8912B: Single-channel MIPI DSI to LVDS/HDMI transmitter bridge.
  • LT89101L: High-performance MIPI-to-LVDS level shifter and redriver.
  • LT9211: Highly integrated bidirectional high-speed MIPI/TTL/LVDS video bridge (supports 1-to-2 duplication or 2-to-1 muxing).
  • LT6911C: HDMI to dual-port MIPI/LVDS converter.
• Drop-in Replacement Targets: Deeply replaces TI’s SN65DSI84 series, Toshiba, and other Japanese video converter brands.

2. Relmon Technology

• Market Position: An established domestic analog and mixed-signal IC design house. Relmon excels in pin-to-pin replacements for FlatLink/FPD-Link general physical layer chips. Several models directly replace classic TI display drivers.
• Key Models & Functions:
  • MS90C385 / MS90C385B: 3.3V 28-bit FlatLink/FPD-Link LVDS serializer transmitter (RGB TTL to LVDS). Direct pin-to-pin replacement for TI’s DS90C385AMT.
  • MS90C386 / MS90C386B: Matching 28-bit LVDS deserializer receiver. Direct replacement for TI’s DS90C386.
  • MS2652D: Low-power, high-speed dual-channel LVDS line driver.
  • MS1023 / MS1224: 10-bit SerDes chipset for high-speed backplane communication over a single differential pair.

3. Runstone Technology

• Market Position: Specializes in industrial-grade general analog chips (op-amps, comparators, logic, and interface circuits). Runstone offers a complete lineup in basic point-to-point physical transmission (Line Drivers/Receivers) with excellent cost-performance.
• Key Models & Functions:
  • RS90LV011: Single-channel high-speed LVDS line driver. Pin-to-pin replacement for TI’s DS90LV011A or onsemi’s FIN1001M5X.
  • RS90LV012: Single-channel high-speed LVDS line receiver. Pin-to-pin replacement for TI’s DS90LV012A or onsemi’s FIN1002M5X.
  • RS90LV049: Dual-channel high-speed LVDS transceiver supporting data rates up to 400 Mbps.
• Drop-in Replacement Targets: Replaces high-volume, small-footprint (SOT-23, TSSOP) basic LVDS chips from global Tier-1 brands in industrial control, power grids, and security security applications.

4. Refac Semiconductor

• Market Position: Focuses on automotive and industrial high-speed data transmission. Driven by high-bandwidth demands for HD screens and ADAS cameras in smart cockpits, Refac leads with automotive-grade high-speed SerDes chips.
• Key Models & Functions:
  • RK100 Series & Automotive HSMT (High-Speed Media Transmission) Chipset: Supports ultra-high-speed video data links from 1.6G, 3G, 6.4G, up to 12.8 Gbps using wide-bandwidth LVDS and multi-channel differential architectures.
• Drop-in Replacement Targets: Targets automotive electronics, matching the technical performance of TI’s FPD-Link III/IV (e.g., DS90UB925) and ADI’s GMSL/GMSL2 links.

5. Chuantu Microelectronics

• Market Position: A prominent domestic vendor for RF, isolators, and high-reliability interface chips. Chuantu Microelectronics stands out by embedding digital isolation technology into LVDS chips, ensuring safe differential signal transmission in high-voltage industrial and medical environments.
• Key Models & Functions:
  • CA-IS3030T / CA-IS3031T / CA-IS3032T: High-performance 1.1 Gbps dual-channel isolated LVDS buffers/repeaters. They combine digital isolation with standard TIA/EIA-644-A LVDS physical layers, supporting up to 3750 Vrms isolation voltage.
• Drop-in Replacement Targets: Fills the gap where traditional physical layer chips lack High Common-Mode Transient Immunity (CMTI). Commonly used in base stations, renewable energy inverters, and industrial AFE modules.

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1. LVDS Interface IC Core Operating Principle and Advantages of LVDS Chips

Traditional data transmission relies on single-wire voltage levels (e.g., 3.3V for 1, 0V for 0). At high frequencies or longer distances, this approach is highly vulnerable to external noise and generates massive electromagnetic radiation.

LVDS completely changes this mechanism with the following core features:

• Differential Signaling: It uses two lines (positive line $V_+$ and negative line $V_-$) to transmit a single signal channel. Instead of checking absolute single-wire voltages, the receiver reads the voltage difference between the two lines. External noise affects both lines equally (common-mode noise), leaving the net difference unchanged. This provides outstanding noise immunity.
• Ultra-Low Voltage Swing: Traditional TTL/CMOS signals swing between 3.3V or 5V, whereas LVDS swings at only around 350 mV. This minimal swing enables incredibly fast switching speeds (up to several Gbps) with negligible power consumption and electromagnetic interference (EMI).

2. Typical Applications for LVDS Interface ICs

Thanks to high bandwidth, noise immunity, and low radiation, LVDS chips are essential in any field requiring high-speed data transmission under noise-sensitive conditions:

1. LCD Panels and Video Transmission (The Classic Use Case)

This is the highest-volume market for LVDS chips. From legacy LCD TVs and desktop monitors to modern laptops, the link between the motherboard (video processor) and the LCD panel (TCON board) heavily relies on LVDS interfaces (such as the FPD-Link protocol).

• Why it’s used: Streaming HD or Full HD video demands massive bandwidth. Traditional ribbon cables generate huge EMI, causing screen flickering or ripples, and fail regulatory compliance. LVDS cleanly handles multi-bit color data over ultra-narrow ribbon cables.

2. Automotive Electronics (Smart Cockpits & ADAS)

Modern vehicles are packed with screens and cameras:

• Smart Cockpits: Data routing for digital instrument clusters, large infotainment screens, and rear-seat entertainment displays.
• ADAS: High-resolution cameras on the front, rear, and mirrors must send real-time road footage instantly and without distortion to the central compute unit (e.g., NVIDIA or TI automated driving SoCs).
• Why it’s used: Car interiors present hostile EMI environments due to spark plugs, motors, and wireless signals, while automotive standards demand extreme safety. Specialized automotive-grade LVDS/SerDes chipsets prevent packet loss and lagging across cables several meters long.

3. Industrial Automation and Machine Vision

• Industrial Displays: Human-Machine Interfaces (HMIs), medical monitors, and rugged screens.
• High-Precision Machine Vision: Industrial cameras on automated assembly lines used for quality checks and robotic arm positioning. These cameras capture hundreds of high-resolution frames per second, requiring instant data offloading to industrial PCs.
• Why it’s used: Factories contain severe high-voltage noise from large inverters and servo motors. Standard interfaces drown in this noise, but LVDS ensures industrial-grade reliability.

4. Telecom Base Stations and Data Center Backplanes

Inside large telecom chassis or servers, multiple cards (blades) plug into a single motherboard (backplane) to exchange high-frequency data.

• Why it’s used: This layout represents a multipoint bus topology. For these scenarios, engineers use M-LVDS (Multipoint LVDS). Multiple M-LVDS transceivers sit on the same backplane bus, delivering high-speed, low-latency interconnection between individual boards.

5. Medical Imaging Equipment

Equipment like CT scanners, MRI machines, and ultrasound systems generate massive amounts of raw data from front-end sensors. Medical environments require pristine signal integrity for weak inputs.

• Why it’s used: The high-speed, low-noise performance of LVDS chips ensures that image acquisition remains free of artifacts caused by transmission noise, preventing misdiagnoses.

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5 Core Functional Categories

1. Standard Point-to-Point Differential Transmission Chips (Drivers / Receivers)

• Functional Definition: The most foundational LVDS physical layer chips. Drivers convert single-ended signals (CMOS/TTL) to differential LVDS; receivers restore LVDS back to single-ended signals. Primarily used for high-speed signal routing between PCBs or over short cables.
• Typical Manufacturers & Models:
  • Texas Instruments (TI): DS90LV031A (Classic quad driver), DS90LV032A (Matching quad receiver), DS90LV011A / DS90LV012A (Single-channel driver/receiver pair)
  • onsemi: FIN1001M5X (Single-channel 5V/3.3V compatible driver), FIN1002M5X (Single-channel receiver)
  • Analog Devices (ADI): MAX9111 / MAX9113 (Low-jitter single/dual receivers, legacy Maxim portfolio)

2. Serializers/Deserializers and Display Link Chips (SerDes / FPD-Link / Channel Link)

• Functional Definition: Compresses multi-channel, low-speed parallel data (such as 24-bit or 28-bit RGB/TTL video data) into a few pairs of high-speed serial LVDS streams via a serializer, which are then restored by a deserializer. Widely used in large displays and laptop panels.
• Typical Manufacturers & Models:
  • Texas Instruments (TI): DS90C385AMT (Classic 3.3V 28-bit FlatLink serializer), DS90C365A (18-bit FlatLink transmitter), DS90UB925Q / DS90UB926Q (Advanced FPD-Link III with integrated audio/control channels for automotive screens)
  • Analog Devices (ADI): MAX9217 / MAX9218 (27-bit, 3 MHz–35 MHz DC-balanced SerDes pair)

3. Protocol Bridges and Format Converters (Bridges)

• Functional Definition: Resolves protocol-level conversions between modern SoC/processor interfaces (e.g., MIPI DSI, eDP) and legacy LCD panels (LVDS interface). These chips manage both physical level shifters and complex protocol-layer logic handshakes.
• Typical Manufacturers & Models:
  • Texas Instruments (TI): SN65DSI84 / SN65DSI83 (MIPI DSI to LVDS bridges for mobile devices and smart hardware display expansions), SN75LVDS83B (Standard industrial RGB to LVDS FlatLink transmitter)
  • NXP Semiconductors: PTN3460I (eDP to LVDS bridge chip; common in industrial PCs, retail terminals, and AIO upgrades)
  • Toshiba: TC358775XBG (Highly integrated MIPI DSI to LVDS bridge)

4. Signal Buffers, Repeaters, and Redrivers

• Functional Definition: Designed to drive long cables (exceeding 3–5 meters) or distribute a single LVDS channel to multiple receivers. It features signal shaping (redriver), de-skewing, and fan-out capabilities without modifying data content.
• Typical Manufacturers & Models:
  • Texas Instruments (TI): SN65LVDS100 (High-speed universal differential repeater supporting LVDS/CML/LVPECL to standard LVDS), DS25BR100 (Single-channel 2.5 Gbps buffer/repeater with input equalization)
  • onsemi: NB6L11M (Ultra-high-speed differential clock/data buffer supporting LVDS outputs for clock tree distribution)
  • Diodes Incorporated: PI3LVD412 (1:2 or 2:1 physical layer multiplexer/demultiplexer switch buffer, legacy Pericom portfolio)

5. Multipoint Bus LVDS / Bus LVDS Transceivers (M-LVDS / BLVDS)

• Functional Definition: Transceivers engineered specifically for multipoint bus topologies. While standard LVDS only handles 1-to-1 links, M-LVDS (TIA/EIA-899) supports up to 32 nodes on a single bus line, allowing half-duplex bidirectional communication. Commonly used in telecom base stations and server backplanes.
• Typical Manufacturers & Models:
  • Texas Instruments (TI): SN65MLVD204A / SN65MLVD206 (Half-duplex M-LVDS transceivers with enhanced ESD and noise immunity), SN65MLVD047 (Quad M-LVDS driver)
  • Analog Devices (ADI): ADN4691E / ADN4696E (3.3V, 200 Mbps enhanced M-LVDS transceivers widely used in telecom equipment racks)